Electronic Component Failure Analysis
2 Failure Analysis Application
(1) The analysis objects including that have failed or have undergone significant changes for component, product in design, production and end-use (field) stage.
(2) Design, process and test screen optimization in design stage.
(3) The selection of components, optimization of secondary screening conditions, control measures of fault control in the production of the equipment, reliability growth, and whole life period maintenance, etc.
3 Case Study
Fig.1: C-SAM & SEM find out IC Bonding pad taken-off
Fig. 2: DECAP and SEM found the Small voltage breakdown of IC
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